30G Thermaltronics- Rosin Flux Paste for Phone PC Cards Electronic Chip-Level Flux Welding Paste Solder Paste Grease- Lead-Free- Soldering Flux Paste which is not Easy to Dump. BGA- Flux Paste

Description

30G Thermaltronics- Rosin Flux Paste for Phone PC Cards Electronic Chip-level Flux Welding Paste Solder Paste Grease- lead-free- soldering flux paste which is not easy to dump. BGA- flux pasteFeatures: Rosin solder paste flux, made of no acid, lead-free- soldering flux paste which is not easy to dump. -BGA flux paste, easy to tin-, less residue-. High-purity,good helper for repairing and welding. Application: for Phone Motherboard- BGA- Soldering Repair Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux WeldingSpecifications: Material: Rosin Soldering PasteColor: As PicturesSize：approx 24x57mm/0.94x2.24inCapacity：30gType: Rosin-based Soldering Flux PasteModel Number: Welding FluxApplication: for Phone Motherboard-BGA Soldering RepairFunction: for Phone PCBs, PC Cards, PGA-, SMD- ReworkNeutral: PH7+ - Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux WeldingPackage Includes: 1PC x Welding FluxNote: Before welding, the welding site and welding wire should be cleaned.Due to the problems of lighting effects and angles, there will be certain tolerances in the product, please understand.Please allow 0-1cm error due to the manual measurment.