Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)
Product ID: 571855077
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Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)
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